【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Resistanceofplastic-encapsulatedSMDstothecombinedeffectofmoistureandsolderingheat
【原文标准名称】:半导体器件.机械和气候试验方法.塑料包封的SMDs的抗湿及钎焊热度综合影响
【标准号】:BSEN60749-20-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2003-07-07
【实施或试行日期】:2003-07-07
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:机械试验;电子设备及元件;电气工程;电子工程;抗湿;耐钎焊温度;试验;半导体器件;气候试验;表面安装装置;表面安装设备;集成电路;半导体;热稳定性;环境试验;元部件
【英文主题词】:Climatictests;Components;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Moistureresistance;Plastics;Semiconductordevices;Semiconductors;SMD;Solderingtemperatureresistance;Surfacemounting;Surfacemountingdevices;Testing;Thermalstability
【摘要】:ThispartofIEC60749appliestosemiconductordevices(discretedevicesandintegratedcircuits).Thistestmethodprovidesameansofassessingtheresistancetosolderingheatofplastic-encapsulatedsurfacemountdevices(SMDs).Thistestisdestructive.NOTEThistestisidenticaltothetestmethodcontainedin2.3ofchapter2ofIEC60749(1996),amendment2,apartfromtheadditionofthisclauseandclause2andthesubsequentrenumbering.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:28P;A4
【正文语种】:英语