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Product Code:SAE AMS3731/10
Title:Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible (NONCURRENT Jan 1993)
Issuing Committee:Ams P Polymeric Materials Committee
Scope:This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.